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9th International Heat Pipe Symposium
Scope of the Symposium
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The 9th International Heat Pipe Symposium (9IHPS) will be held in Kuala Lumpur from 17 to 20 November 2008. This Symposium is held once every 2/3 years and alternating with the International Heat Pipe Conference (IHPC). It will bring together engineers, scientists and industry working in the field of Heat and Mass Transfer especially in heat pipes, heat pipe heat exchangers and semi-conductor cooling. Heat pipes are highly efficient heat transfer devices and are becoming increasingly applied not only in the fields of semiconductor cooling but also for heat and energy recovery. This international symposium will provide a forum for the exchange of the latest scientific R & D information as well as the technologies developed for commercial development of heat pipes.
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9th International Heat Pipe Symposium |
Internationally well-known researchers from universities and entrepreneurs will present keynote papers. During the symposium, participants would have the opportunity to discuss and see some commercial products which would be displayed simultaneously in the Exhibition Hall.
Who should attend
Engineers, Scientists, Technologists, Academics, Industrialists, Policy-makers, Entrepreneurs as well as members of the General Public who are interested to know more about new and innovative heat pipes for cooling applications and industrial heat exchange technologies.
Symposium topics
Technical sessions would include but not limited to the following areas:
- Heat transfer and fluid dynamics associated with modeling heat pipes.
- Performance of heat pipes, thermosyphons, CPL’s, LHP’s, micro-heat pipes, etc.
- Semi conductor cooling and thermal control.
- Industrial applications of heat pipes.
- New developments in heat pipe design and technology.
- State of art in heat pipe technology.
Call for Papers
The Symposium will be conducted in English. Papers are being solicited for the Symposium. Contributors should submit an extended abstract
Deadline for Abstract Submission
Notification of Abstract Acceptance
Deadline for Full Paper Submission
Notification of Acceptance of Full Paper
Deadline for Earlybird Registration
Deadline for Registration (Standard) |
January 31, 2008
February 29, 2008
March 29, 2008
May 31. 2008
June 30, 2008
August 9, 2008 |
Sponsors
- Monash Univesity Malaysia
- Japan Heat Pipe Association
- Institution of Mechanical Engineers Malaysia Branch
- Fujikura Ltd
- Vital Series Sdn. Bhd
For more information, please contact:
A/Prof Ong Kok-Seng,
Chairman of the 9th IHPS
School of Engineering, Monash University Malaysia
Tel: +603 5636 0600
Fax: +603 5632 9315
Email: ong.kok.seng@eng.monash.edu.my
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